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1700V

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·PRODUCT

MOSFET

1700V

 
Part Number
BVDSS
[V]
RDS(ON)
[mΩ] 
Application
Package
TMV060N170TC
1700
R&D
SMPS,Inverter
TO264

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SYS-421GE-TNHR2-LCC
Key Features 1. 5th/4th Gen Intel® Xeon® Scalable processor support 2. 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5 3. 8 PCIe Gen 5.0 X16 LP 2 PCIe Gen 5.0 X16 FHHL Slots, 2 PCIe Gen 5.0 X16 FHHL Slots (optional) 4. Flexible networking options 5. 2 M.2 NVMe for boot drive only Optional: 8x 2.5" Hot-swap SATA drive bays 8x 2.5" Hot-swap NVMe drive bays 6. 4 heavy duty fans with optimal fan speed control 7. 4x 5250W(2+2) Redundant Power Supplies, Titanium Level

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Key Features 1. 8 NIC for GPU direct RDMA (1:1 GPU Ratio) High density 8U system with AMD Instinct MI300X 8-GPU 2. 24 DIMM Slots; Up to 6TB DRAM; 4800 ECC DDR5 LRDIMM;RDIMM; 3. 8 PCIe Gen 5.0 X16 LP, and up to 4 PCIe Gen 5.0 X16 FHFL Slots 4. Flexible networking options 5. 2x 2.5" Hot-swap SATA drive bays 1 M.2 NVMe for boot drive only up to 16x 2.5" Hot-swap NVMe drive bays (12 by default + 4 optional) 6. 10 heavy duty fans with optimal fan speed control 7. 6x 3000W redundant Titanium level power supplies

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1. 5th/4th Gen Intel® Xeon® Scalable processors With PCIE Gen 5 Platform GPU Memory Bandwidth: 3276.8 GB/s GPU Memory: 1TB HBM2 GPU to GPU Interconnect: 742 GB/s XeLink Scale Up Bandwidth High Density Computing: 8 x Intel® Data Center GPU Max 1550 (600W) OAM Open Ecosystem with oneAPI Performance: 6.7 petaFLOPS FP16/BF16 2. 32x DIMM slots, ECC DDR5 RDIMM up to 8TB and 5600MTS

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